晶圓減薄（晶圓拋光）GDM300_Hapoin衡鵬




晶圓減薄（晶圓拋光）GDM300特長：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.



了解更多：http://www.hapoin.com/Wafer_Grinding/


晶圓減薄（晶圓拋光）GDM300相關產品：
Hapoin衡鵬供應
晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding   GNX200BP